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Sujay Singh, Jifa Hao, Daniel Hoffman, Thomas Dixon, Andrew Zedolik, Joe Fazio,and Thomas E. Kopley (2017) ¡°Effects of Die-Attach Voids on the Thermal Impedance?of Power Electronic Packages¡± , IEEE Transaction on Components, Packaging and Manufacturing Technology, Vol. 7, No. 10, October 2017, pp. 1608-1616.

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